Европейская академия естественных наук Hannover E.V.

Wei Jun

Prof Jun Wei is a China National Distinguished Expert, Deputy Secretary General of Asia-Pacific Academy of Sciences, Assistant to the President of Harbin Institute of Technology (Shenzhen), Director of Shenzhen Key Laboratory of Flexible Printed Electronics Technology, Director of Harbin Institute of Technology (Shenzhen) Flexible Printed Electronics Technology Center. Before joining Harbin Institute of Technology (Shenzhen), Professor Jun Wei was the Principal Scientist of the Agency for Science, Technology and Research (A*STAR) in Singapore, one of the founders of additive manufacturing in Singapore, and the founders of flexible printed electronics in Singapore. He was used to serve as the Research Liaison Office Director of Singapore Institute of Manufacturing Technology (SIMTech), the Programme Manager and Principal Investigator of the A*STAR “Industrial Additive Manufacturing” Thematic Strategic Research Programme, the Principal Investigator of A*STAR “Additive Manufacturing Center (AMC) Initiative”, the Director of "3D Additive Manufacturing" Joint Laboratory between SIMTech-Nanyang Technological University, Director of "Large Area Flexible Hybrid Electronics" Joint Laboratory between SIMTech-National University of Singapore, Flexible Printed Electronics Programme Manager, Joining Technology Group Manager. He has been engaged in the basic and applied research of advanced manufacturing technology for more than 30 years. A number of research results have been applied by many world's top companies. Prof Wei’s research mainly focus on additive manufacturing and flexible printed electronics. He has authored and co-authored over 550 SCI papers in Chemical Society Reviews, Progress in Materials Science, Science Advances, Advanced Science, Electrochemical Energy Reviews, Energy & Environmental Science, Advanced Materials, Advanced Functional Materials, ACS Nano, JACS, Small, Additive Manufacturing, Materials & Design, Journal of Materials Science & Technology, Acta Materialia, Scripta Materialia etc. with citations over 32,000 times and H-index of 89. He delivered more than 400 speeches at international academic conferences and forums. He is holding more than 80 technology disclosures and patents. He is serving several international conference committees and editorial boards.

 

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