Европейская академия естественных наук Hannover E.V.

Huang Shuangwu

Prof. Huang Shuangwu is a national distinguished expert of the People's Republic of China and a distinguished professor at college of Electronics and Information Engineering and Director of the Assembly and Testing Center of Shenzhen University in China., He was Guest Professor at the College of Materials and Chemistry, Ningbo University and Postdoctoral Research Fellow at the National University of Singapore. He holds Ph.D. in Polymer Chemistry from the Institute of Chemistry, Chinese Academy of Sciences and served as Technical Consultant at the Institute of Microelectronics (IME) in Singapore.

Prof. Huang has more than 25 years working experience in electronic and semiconductor industry inclusive of Speed Wireless Technology as the CTO, responsible for TSV manufacturing and fingerprint module packaging technology development. a Senior Engineer at Hitachi Chemical Advanced Packaging (HCAP), Principal Engineer at Micron Technology, Senior Manager at StatschipPAC etc.

Prof. Huang has in-depth knowledge and knowhow especially in semiconductor areas including IC packaging materials and advanced assembly technologies such as Flip Chip in Package (FCIP), System-in-Package/Multi-Chip Module (SiP/MCM), Wafer-Level Chip-Scale Packaging (WLCSP), Copper Pillar Interconnect (Cu-Pillar), Through-Silicon Via (TSV), and Fan-Out Panel-Level Packaging (FOPLP) and so on. He holds more than 100 SCI technical papers and more than 100 patents issued in US, Singapore and China. Meanwhile，Prof. HUANG serves as a committee member and co-chair of CSTIC from 2012 till now. He has led a lot of key industrial projects and successfully transfer cutting-edge technologies into commercialization.

 

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